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Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of ...
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low-temperature solder (LTS) alloys have recently ...